The following are its main application areas:
Automotive field: sensor housing, wire and cable insulation layer
Electronic field: integrated circuit packaging, connectors and sockets
Medical field: device components, implantable devices
Food packaging field: packaging containers, equipment components
The following are its main application areas:
Automotive field: sensor housing, wire and cable insulation layer
Electronic field: integrated circuit packaging, connectors and sockets
Medical field: device components, implantable devices
Food packaging field: packaging containers, equipment components